SILVER SINTERING COMPOSITIONS WITH FLUXING OR REDUCING AGENTS FOR METAL ADHESION

A conductive composition that is sinterable comprises (i) micron- or submicron-sized silver flakes or powders and (ii) a fluxing agent, or an oxygenated solvent, or a peroxide. The composition can be used to adhere semiconductor dies with silver backing to copper-, silver-, or gold lead-frames at si...

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Bibliographic Details
Main Authors SANCHEZ, JULIET GRACE, KUDER, HARRY RICHARD
Format Patent
LanguageEnglish
French
Published 06.02.2014
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CONDUCTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SEMICONDUCTOR DEVICES
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Summary:A conductive composition that is sinterable comprises (i) micron- or submicron-sized silver flakes or powders and (ii) a fluxing agent, or an oxygenated solvent, or a peroxide. The composition can be used to adhere semiconductor dies with silver backing to copper-, silver-, or gold lead-frames at sintering temperatures of ? 250 C without the application of pressure. L'invention concerne une composition conductrice frittable comprenant (i) des flocons ou des poudres d'argent de taille micronique ou sous-micronique et (ii) un agent de fluage, ou un solvant oxygéné ou un peroxyde. La composition peut être utilisée pour l'adhérence de puces à semi-conducteur avec un support en argent sur des cadres de cuivre, d'argent, d'or ou de plomb à des températures de frittage de 250°C sans application de pression.
Bibliography:Application Number: WO2013US52511