CONDUCTIVE PARTICLE, RESIN PARTICLE, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE

• Main Author: UENOYAMA, SHINYA
• Format: Patent
• Language: English; French; Japanese
• Published: 09.01.2014
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; CURRENT COLLECTORS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; INSULATORS; LINE CONNECTORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES; WORKING-UP

Provided is a conductive particle whereby, when electrically connecting electrodes with the conductive particle, connection resistance is lowered, and it is possible to increase connection reliability. A conductive particle according to the present invention comprises a resin particle (2), and a conductive layer (3) which is positioned upon the surface of the resin particle (2). A compressive elasticity modulus when the conductive particle (1) is compressed by 10% is 1500-5000N/mm2. A ratio of the compressive elasticity modulus when the conductive particle (1) is compressed by 10% to a compressive elasticity modulus when the conductive particle (1) is compressed by 50% is 2-10. L'invention concerne une particule conductrice grâce à laquelle, lors de la connexion électrique d'électrodes avec la particule conductrice, la résistance à la connexion peut être diminuée et il est possible d'augmenter la fiabilité de la connexion. La particule conductrice selon la présente invention comprend une particule de résine (2), et une couche conductrice (3) disposée sur la surface de la particule de résine (2). Un module d'élasticité en compression, lorsque la particule conductrice (1) est comprimée de 10%, est de 1500-5000N/mm2. Le rapport entre le module d'élasticité en compression, lorsque la particule conductrice (1) est comprimée de 10%, et le module d'élasticité en compression, lorsque la particule conductrice (1) est comprimée de 50%, est de 2-10.