DICING TAPE FOR ROUGH SURFACE DIE ATTACH FILM

A dicing tape comprises a carrier and a pressure sensitive adhesive in which the thickness of the pressure sensitive adhesive is 15mum to 50mum. With this thickness, conductive die attach adhesive film bundled with the dicing tape removes cleanly from the dicing tape. L'invention porte sur une...

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Bibliographic Details
Main Authors CHOW, MINA, KIM, YOUNSANG
Format Patent
LanguageEnglish
French
Published 20.06.2013
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:A dicing tape comprises a carrier and a pressure sensitive adhesive in which the thickness of the pressure sensitive adhesive is 15mum to 50mum. With this thickness, conductive die attach adhesive film bundled with the dicing tape removes cleanly from the dicing tape. L'invention porte sur une bande de découpage, laquelle bande comprend un support et un adhésif sensible à la pression, bande dans laquelle l'épaisseur de l'adhésif sensible à la pression est de 15 mum à 50 mum. Avec cette épaisseur, un film adhésif d'attachement de puce conductrice mis en faisceau avec la bande de découpage effectue un retrait propre à partir de la bande de découpage.
Bibliography:Application Number: WO2012US65984