METHOD AND APPARATUS PROVIDING ELECTRICAL CONNECTION TO A PHOTOVOLTAIC MODULE

Disclosed embodiments include photovoltaic modules having a conductor interface and a heat-activated adhesive layer configured to bond the conductor interface to the module. Methods of manufacturing photovoltaic modules having a conductor interface and heat-activated adhesive layer are also disclose...

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Bibliographic Details
Main Author MALIK, RICHARD S., JR
Format Patent
LanguageEnglish
French
Published 23.05.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Disclosed embodiments include photovoltaic modules having a conductor interface and a heat-activated adhesive layer configured to bond the conductor interface to the module. Methods of manufacturing photovoltaic modules having a conductor interface and heat-activated adhesive layer are also disclosed. Des modes de réalisation de la présente invention comprennent des modules photovoltaïques ayant une interface de conducteur et une couche adhésive thermo-activée configurée pour lier l'interface de conducteur au module. La présente invention porte également sur des procédés de fabrication de modules photovoltaïques ayant une interface de conducteur et une couche adhésive thermo-activée.
Bibliography:Application Number: WO2012US63335