HEAT-DISSIPATING MATERIAL AND METHOD FOR PRODUCING SAME, AND ELECTRONIC DEVICE AND METHOD FOR PRODUCING SAME

A heat-dissipating material comprises: multiple linear structures each having a first end and a second end and composed of element carbon; a diamond-like carbon layer that covers the first ends of the multiple linear structures; and filling layers each arranged between each adjacent two of the multi...

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Bibliographic Details
Main Authors SAKITA, YUKIE, NORIMATSU, MASAAKI, YAGISHITA, YOHEI, HIROSE, SHINICHI, YAMAGUCHI, YOSHITAKA, IWAI, TAISUKE
Format Patent
LanguageEnglish
French
Japanese
Published 04.04.2013
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOUNDS THEREOF
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INORGANIC CHEMISTRY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
NON-METALLIC ELEMENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A heat-dissipating material comprises: multiple linear structures each having a first end and a second end and composed of element carbon; a diamond-like carbon layer that covers the first ends of the multiple linear structures; and filling layers each arranged between each adjacent two of the multiple linear structures. L'invention porte sur un matériau dissipateur thermique comprenant : de multiples structures linéaires ayant chacune une première extrémité et une seconde extrémité et composées de carbone élémentaire ; une couche de carbone de type diamant qui recouvre les premières extrémités des multiples structures linéaires ; et des couches de remplissage disposées chacune entre chaque paire de structures linéaires adjacentes des multiples structures linéaires.
Bibliography:Application Number: WO2011JP71864