MODULE MANUFACTURING METHOD AND MODULE

• Main Authors: OTSUBO, YOSHIHITO, OGAWA, NOBUAKI
• Format: Patent
• Language: English; French; Japanese
• Published: 14.03.2013
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention relates to a method by which a module may be manufactured at a low cost and within a short period of time and an inter-layer connection conductor may be formed without having to form a via hole by mounting an approximately T-shaped connecting terminal on a wiring substrate. A m...