PLASMA ACTIVATED CONFORMAL DIELECTRIC FILM DEPOSITION
Methods of depositing a film on a substrate surface include surface mediated reactions in which a film is grown over one or more cycles of reactant adsorption and reaction. In one aspect, the method is characterized by intermittent delivery of dopant species to the film between the cycles of adsorpt...
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Main Authors | , |
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Format | Patent |
Language | English French |
Published |
10.05.2013
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Subjects | |
Online Access | Get full text |
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Summary: | Methods of depositing a film on a substrate surface include surface mediated reactions in which a film is grown over one or more cycles of reactant adsorption and reaction. In one aspect, the method is characterized by intermittent delivery of dopant species to the film between the cycles of adsorption and reaction.
L'invention concerne des procédés de dépôt de film sur une surface de substrat incluant des réactions induites par la surface. Selon l'invention, on fait grandir un film sur un ou plusieurs cycles d'adsorption de réactifs et de réaction. Dans un aspect, le procédé est caractérisé par l'alimentation intermittente de substances dopantes dans le film entre les cycles d'adsorption et de réaction. |
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Bibliography: | Application Number: WO2012US51740 |