ETCHANT LIQUID COMPOSITION FOR A METAL LAYER, INCLUDING COPPER AND TITANIUM

• Main Authors: LEE, SUCK-JUN, PARK, YOUNGUL, KANG, KYOUNG-MIN, JANG, SANG-HOON
• Format: Patent
• Language: English; French; Korean
• Published: 07.03.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; SEMICONDUCTOR DEVICES

The present invention relates to an etchant liquid composition for a metal layer, the composition comprising: persulfate; a fluorine-containing compound; an inorganic acid; a ring-type amine compound; a compound containing chlorine; phosphate; and water. More particularly, the present invention relates to an etchant liquid composition for a metal layer, the composition comprising copper and titanium. La présente invention concerne une composition liquide d'agent d'attaque chimique pour une couche métallique, la composition comprenant : du persulfate; un composé contenant du fluor; un acide inorganique; un composé amine de type anneau; un composé contenant du chlore; du phosphate; et de l'eau. Plus particulièrement, la présente invention concerne une composition liquide d'agent d'attaque chimique pour une couche métallique, la composition comprenant du cuivre et du titane.