CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

Provided are: conductive particles capable of suppressing the clumping of a plurality of conductive particles, and reducing the connection resistance between electrodes when used in the connection between electrodes; and a conductive material using the conductive particles. These conductive particle...

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Bibliographic Details
Main Authors OOTSUKA, MASAHIRO, NISHIOKA, KEIZO
Format Patent
LanguageEnglish
French
Japanese
Published 31.01.2013
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CONDUCTORS
CURRENT COLLECTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
LINE CONNECTORS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SEMICONDUCTOR DEVICES
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Summary:Provided are: conductive particles capable of suppressing the clumping of a plurality of conductive particles, and reducing the connection resistance between electrodes when used in the connection between electrodes; and a conductive material using the conductive particles. These conductive particles (1) have substrate particles (2), and a conductive layer (3) disposed on the surface of the substrate particles (2) and including at least one type of metal component selected from the following: nickel, boron, tungsten and molybdenum. This conductive material includes the conductive particles (1) and a binder resin. L'invention concerne : des particules conductrices capables de supprimer l'agglomération d'une pluralité de particules conductrices et de réduire la résistance de connexion entre des électrodes lorsqu'elles sont utilisées dans l'interconnexion d'électrodes ; et un matériau conducteur utilisant ces particules conductrices. Les particules conductrices (1) comprennent des particules de substrat (2) et une couche conductrice (3) disposée sur la surface des particules de substrat (2) et contenant au moins un type de composant métallique choisi parmi le nickel, le bore, le tungstène et le molybdène. Le matériau conducteur contient les particules conductrices (1) et une résine liante.
Bibliography:Application Number: WO2012JP68800