WAFER-CLAMPING DEVICE USING SPRING CLIPS

• Main Authors: HU, JINCHUN, MU, HAIHUA, YIN, WENSHENG, XU, DENGFENG, YU, DONGDONG, ZHU, YU, WANG, JINSONG, ZHANG, MING, CUI, LEQING, LI, XIN, YANG, KAIMING
• Format: Patent
• Language: Chinese; English; French
• Published: 03.01.2013
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A wafer-clamping device using spring clips. The device comprises a tray (101), wafer clamps (108), and protruding support blocks (106). A wafer clamp (108) comprises a support (102), a connection rod (104), a spring (105), and a sliding block (103). During a wafer (109) capture, the edge of the wafer (109) is in contact with the slander parts of the sliding blocks (103). The component force of the wafer gravity causes the sliding blocks (103) to move along the connection rods (104) toward the supports (102), and causes the springs to compress, and the wafer (109) is clamped among the wafer clamps (108). The bottom surface of the wafer is in contact with the top surface of the four protruding support blocks (106), and the wafer is supported by the protruding support blocks (106). The edge of the wafer is in contact with the side of the sliding blocks. The springs deform and exert a certain degree of pressure on the edge of the wafer, and tightly clamp the wafer, thereby fastening the wafer in place. By changin