COPPER FILLED OPENING WITH A CAP LAYER

• Main Authors: DAMBROWSKY, NINA, GAIDA, JOSEF, UHLIG, ALBRECHT, VAN DEN BOOM, RUUD, ROHDE, DIRK
• Format: Patent
• Language: English; French
• Published: 20.12.2012
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The invention concerns openings in substrates filled with a copper deposit. Thermal annealing processes lead to an irreversible expansion of said copper deposit and hence to the formation of voids in the copper deposit and cracks between the surface of the substrate and active or passive overlying structures. The present invention provides cap layers which suppress the irreversible expansion of copper during or after thermal annealing. La présente invention concerne des ouvertures dans des substrats remplies avec un dépôt de cuivre. Des procédés de recuit thermique entraînent une dilatation irréversible dudit dépôt de cuivre et ainsi la formation de vides dans le dépôt de cuivre et de fissures entre la surface du substrat et des structures de recouvrement actives ou passives. La présente invention concerne des couches capots qui suppriment la dilatation irréversible du cuivre pendant ou après le recuit thermique.