PRESSURE UNIT
Provided is a pressure unit with which it is possible to absorb deviations in dimensions when manufacturing an object to be pressured, and to achieve greater thinness with a simple configuration. The pressure unit pressures a semiconductor layer unit wherein semiconductor element modules and coolant...
Saved in:
| Main Authors | , , , , |
|---|---|
| Format | Patent |
| Language | English French Japanese |
| Published |
20.09.2012
|
| Subjects | |
| Online Access | Get full text |
Cover
Loading…
| Abstract | Provided is a pressure unit with which it is possible to absorb deviations in dimensions when manufacturing an object to be pressured, and to achieve greater thinness with a simple configuration. The pressure unit pressures a semiconductor layer unit wherein semiconductor element modules and coolant pipes which make contact with the semiconductor element modules and cool the semiconductor element modules are alternately stacked. The pressure unit comprises: a spring member wherein a wire material is wound into a coil shape, a pitch angle whereof changing periodically; and a housing member, whereto the end parts of the spring member are attached.
L'invention porte sur une unité de pression au moyen de laquelle il est possible d'absorber des écarts de dimensions lors de la fabrication d'un objet à pressuriser, et d'obtenir une plus grande minceur avec une configuration simple. L'unité de pression pressurise une unité de couche semi-conductrice dans laquelle des modules d'élément semi-conducteur et des tuyaux d'élément refroidissant qui réalisent un contact avec les modules d'élément semi-conducteur et refroidissent les modules d'élément semi-conducteur sont empilés de manière alternée. L'unité de pression comprend : un élément de ressort dans lequel un matériau de fil est entouré selon une forme de bobine, un angle de pas de celle-ci changeant de manière périodique ; et un élément de boîtier, sur lequel les parties d'extrémité de l'élément de ressort sont attachées. |
|---|---|
| AbstractList | Provided is a pressure unit with which it is possible to absorb deviations in dimensions when manufacturing an object to be pressured, and to achieve greater thinness with a simple configuration. The pressure unit pressures a semiconductor layer unit wherein semiconductor element modules and coolant pipes which make contact with the semiconductor element modules and cool the semiconductor element modules are alternately stacked. The pressure unit comprises: a spring member wherein a wire material is wound into a coil shape, a pitch angle whereof changing periodically; and a housing member, whereto the end parts of the spring member are attached.
L'invention porte sur une unité de pression au moyen de laquelle il est possible d'absorber des écarts de dimensions lors de la fabrication d'un objet à pressuriser, et d'obtenir une plus grande minceur avec une configuration simple. L'unité de pression pressurise une unité de couche semi-conductrice dans laquelle des modules d'élément semi-conducteur et des tuyaux d'élément refroidissant qui réalisent un contact avec les modules d'élément semi-conducteur et refroidissent les modules d'élément semi-conducteur sont empilés de manière alternée. L'unité de pression comprend : un élément de ressort dans lequel un matériau de fil est entouré selon une forme de bobine, un angle de pas de celle-ci changeant de manière périodique ; et un élément de boîtier, sur lequel les parties d'extrémité de l'élément de ressort sont attachées. |
| Author | TSURUGAI, KENGO SASUGA, ICHIRO KATO, NOBUHARU TAKAMURA, NORITOSHI MASUDA, MICHIYA |
| Author_xml | – fullname: KATO, NOBUHARU – fullname: MASUDA, MICHIYA – fullname: SASUGA, ICHIRO – fullname: TSURUGAI, KENGO – fullname: TAKAMURA, NORITOSHI |
| BookMark | eNrjYmDJy89L5WTgDQhyDQ4ODXJVCPXzDOFhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHh_kYGhkaGRibmFsaOhsbEqQIA7qsfdw |
| ContentType | Patent |
| DBID | EVB |
| DatabaseName | esp@cenet |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Medicine Chemistry Sciences |
| DocumentTitleAlternate | UNITÉ DE PRESSION |
| ExternalDocumentID | WO2012124783A1 |
| GroupedDBID | EVB |
| ID | FETCH-epo_espacenet_WO2012124783A13 |
| IEDL.DBID | EVB |
| IngestDate | Fri Jul 19 15:30:22 EDT 2024 |
| IsOpenAccess | true |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | English French Japanese |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-epo_espacenet_WO2012124783A13 |
| Notes | Application Number: WO2012JP56773 |
| OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120920&DB=EPODOC&CC=WO&NR=2012124783A1 |
| ParticipantIDs | epo_espacenet_WO2012124783A1 |
| PublicationCentury | 2000 |
| PublicationDate | 20120920 |
| PublicationDateYYYYMMDD | 2012-09-20 |
| PublicationDate_xml | – month: 09 year: 2012 text: 20120920 day: 20 |
| PublicationDecade | 2010 |
| PublicationYear | 2012 |
| RelatedCompanies | TSURUGAI, KENGO SASUGA, ICHIRO KATO, NOBUHARU TAKAMURA, NORITOSHI NHK SPRING CO., LTD MASUDA, MICHIYA |
| RelatedCompanies_xml | – name: TAKAMURA, NORITOSHI – name: TSURUGAI, KENGO – name: NHK SPRING CO., LTD – name: SASUGA, ICHIRO – name: KATO, NOBUHARU – name: MASUDA, MICHIYA |
| Score | 2.9745042 |
| Snippet | Provided is a pressure unit with which it is possible to absorb deviations in dimensions when manufacturing an object to be pressured, and to achieve greater... |
| SourceID | epo |
| SourceType | Open Access Repository |
| SubjectTerms | BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MEANS FOR DAMPING VIBRATION MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES SHOCK-ABSORBERS SPRINGS THERMAL INSULATION IN GENERAL WEAPONS |
| Title | PRESSURE UNIT |
| URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120920&DB=EPODOC&locale=&CC=WO&NR=2012124783A1 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQsUi0MDVNNDTRTbNMMdMF1tAWuokpxsCGnKlpWqJBonmiZRr4tE8_M49QE68I0wgmhhzYXhjwOaHl4MMRgTkqGZjfS8DldQFiEMsFvLayWD8pEyiUb-8WYuuiBu0dgzaCGhmouTjZugb4u_g7qzk7A_ttan5BYDlgVWZuYewI7CuxghrSoJP2XcOcQPtSCpArFTdBBrYAoHl5JUIMTFmJwgyczrC714QZOHyhU95AJjT3FYsw8IKDKzTIVQHYawsRZVB2cw1x9tAFmhsP90Z8uD-yI4zFGFiAHfxUCQYF4ySTZFBT3wIYqyZJpkaWSYbmycYpqUkGSRZpKWYWkgwy-EySwi8tzcAF4oLWOBgZyDCwlBSVpsoCK9KSJDmw_wHFbHON |
| link.rule.ids | 230,309,786,891,25594,76904 |
| linkProvider | European Patent Office |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQsUi0MDVNNDTRTbNMMdMF1tAWuokpxsCGnKlpWqJBonmiZRr4tE8_M49QE68I0wgmhhzYXhjwOaHl4MMRgTkqGZjfS8DldQFiEMsFvLayWD8pEyiUb-8WYuuiBu0dgzaCGhmouTjZugb4u_g7qzk7A_ttan5BYDlgVWZuYewI7CuxmgM7haCT9l3DnED7UgqQKxU3QQa2AKB5eSVCDExZicIMnM6wu9eEGTh8oVPeQCY09xWLMPCCgys0yFUB2GsLEWVQdnMNcfbQBZobD_dGfLg_siOMxRhYgB38VAkGBeMkk2RQU98CGKsmSaZGlkmG5snGKalJBkkWaSlmFpIMMvhMksIvLc_A6RHi6xPv4-nnLc3ABZICrXcwMpBhYCkpKk2VBVaqJUly4LAAAFJRdng |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=PRESSURE+UNIT&rft.inventor=KATO%2C+NOBUHARU&rft.inventor=MASUDA%2C+MICHIYA&rft.inventor=SASUGA%2C+ICHIRO&rft.inventor=TSURUGAI%2C+KENGO&rft.inventor=TAKAMURA%2C+NORITOSHI&rft.date=2012-09-20&rft.externalDBID=A1&rft.externalDocID=WO2012124783A1 |