ADHESIVE COMPOSITION FOR A WAFER PROCESSING FILM

The present invention relates to an adhesive composition for a wafer processing film, a wafer processing film, and a semiconductor wafer processing method. In the semiconductor wafer processing process such as a dicing process or a back grinding process, a delaminating force with respect to a wafer...

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Bibliographic Details
Main Author KIM, JANGSOON
Format Patent
LanguageEnglish
French
Korean
Published 13.09.2012
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:The present invention relates to an adhesive composition for a wafer processing film, a wafer processing film, and a semiconductor wafer processing method. In the semiconductor wafer processing process such as a dicing process or a back grinding process, a delaminating force with respect to a wafer to be attached may be effectively reduced to improve process efficiency and prevent the wafer from being warped or cracked. La présente invention concerne une composition adhésive pour un film de traitement de tranche, un film de traitement de tranche, et un procédé de production de tranche de semi-conducteur. Dans le procédé de traitement de tranche de semi-conducteur tel qu'un procédé de découpage en dés ou un procédé d'abrasion arrière, une force de délaminage par rapport à une tranche à fixer peut être efficacement réduite pour améliorer l'efficacité de traitement et éviter que la tranche soit voilée ou fissurée.
Bibliography:Application Number: WO2012KR01672