SUBSTRATE HAVING ETCHING MASK AND METHOD FOR PRODUCING SAME

Provided are: a substrate that has an etching mask and that is capable of high definition patterning; and a method for producing the substrate. A photosensitive material is applied onto the surface of the substrate and subjected to exposure/development to form a resist pattern, a DLC coating film is...

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Bibliographic Details
Main Authors SUGAWARA, SHINTARO, SHIGETA, TATSUO, SHIGETA, KAKU
Format Patent
LanguageEnglish
French
Japanese
Published 16.08.2012
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Summary:Provided are: a substrate that has an etching mask and that is capable of high definition patterning; and a method for producing the substrate. A photosensitive material is applied onto the surface of the substrate and subjected to exposure/development to form a resist pattern, a DLC coating film is formed on the surface of the substrate and resist pattern, the DLC coating film formed on the resist pattern is delaminated together with the resist pattern, and thus a DLC pattern is formed on the surface of the substrate. La présente invention concerne : un substrat qui a un masque de gravure et qui est capable de modelage à haute définition ; et un procédé pour produire le substrat. Un matériau photosensible est appliqué sur la surface du substrat et soumis à une exposition/développement pour former un motif de réserve, un film de revêtement DLC est formé sur la surface du substrat et du motif de réserve, le film de revêtement DLC formé sur le modèle de réserve est délaminé conjointement avec le motif de réserve, et ainsi un motif DLC est formé sur la surface du substrat.
Bibliography:Application Number: WO2012JP52859