CHAMBER LID HEATER RING ASSEMBLY

Embodiments of the invention generally provide a lid heater for a plasma processing chamber. In one embodiment, a lid heater assembly is provided that includes a thermally conductive base. The thermally conductive base has a planar ring shape defining an inner opening. The lid heater assembly furthe...

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Bibliographic Details
Main Authors GRIMBERGEN, MICHAEL, N, YU, KEVEN, KAISHENG, SCOTT, GRAEME, OUYE, ALAN, H
Format Patent
LanguageEnglish
French
Published 26.04.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Embodiments of the invention generally provide a lid heater for a plasma processing chamber. In one embodiment, a lid heater assembly is provided that includes a thermally conductive base. The thermally conductive base has a planar ring shape defining an inner opening. The lid heater assembly further includes a heating element disposed on the thermally conductive base, and an insulated center core disposed across the inner opening of the thermally conductive base. Des modes de réalisation de l'invention fournissent généralement un dispositif de chauffage à couvercle pour une chambre de traitement au plasma. Dans un mode de réalisation, un ensemble dispositif de chauffage à couvercle comprend une base thermoconductrice. La base thermoconductrice présente une forme annulaire plane définissant une ouverture intérieure. L'ensemble dispositif de chauffage à couvercle comprend en outre un élément chauffant disposé sur la base thermoconductrice, et un noyau central isolé disposé sur toute l'étendue de l'ouverture intérieure de la base thermoconductrice.
Bibliography:Application Number: WO2011US55100