ELEMENT HOUSING PACKAGE, AND ELECTRONIC DEVICE USING THE SAME

• Main Author: SATAKE, TAKEO
• Format: Patent
• Language: English; French; Japanese
• Published: 05.04.2012
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An element housing package comprises: a substrate (1) having a mount portion (1a) on which a semiconductor element (9) is provided on a surface thereof; a frame (2) having notched portions (2b) formed by making cutouts in side walls; I/O terminals (3) having circuit conductor layers (3a) electricall...