SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Disclosed is a semiconductor device which comprises: a first semiconductor element (1); a second semiconductor element (4); a first lead frame (3) that has a first die pad portion (9) on which the first semiconductor element (1) is mounted; and a second first lead frame (5) that has a second die pad...
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Main Authors | , , |
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Format | Patent |
Language | English French Japanese |
Published |
26.01.2012
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Subjects | |
Online Access | Get full text |
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