SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Disclosed is a semiconductor device which comprises: a first semiconductor element (1); a second semiconductor element (4); a first lead frame (3) that has a first die pad portion (9) on which the first semiconductor element (1) is mounted; and a second first lead frame (5) that has a second die pad...

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Bibliographic Details
Main Authors MINAMIO, MASANORI, OGA, AKIRA, TOMITA, YOSHIHIRO
Format Patent
LanguageEnglish
French
Japanese
Published 26.01.2012
Subjects
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