MASK

• Main Authors: ABE, KEIKO, KATO, YUKO, KAMESAKI, KOUJI, ETOU, KENJI, HORI, EISUKE, OKAYAMA, TOMOHIKO, SHIMIZU, MIHO, KIKUCHI, MASASHI, SHIMODA, KEISUKE
• Format: Patent
• Language: English; French; Japanese
• Published: 27.10.2011
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

Disclosed is a mask, which is to be used in a step of manufacturing an organic EL display device, and which has a thinner shadow mask section compared with conventional shadow mask sections. A substrate (6) is carried into a vacuum processing apparatus (10), and the mask (1) and the substrate (6) are aligned with each other. The mask (1) has: a frame (8); the tape-like shadow mask section (2), which is disposed on the frame (8), and which is composed of a metal; an attaching apparatus (3) which fixes one end of the shadow mask section (2); a conversion member (4), which converts the other end of the shadow mask section (2) to be in the vertical direction from the horizontal direction; and a weight (5) which is attached to the other end. Tensile force is applied to the shadow mask section (2) by the weight (5). Since the shadow mask section (2) does not loosen due to the tensile force, reactive plasma does not enter between the shadow mask section and the substrate (6). With the shadow mask section (2), which is thinner than conventional shadow mask sections, a film can be more uniformly formed also on the substrate (6) surface at the periphery of the mask (1). L'invention concerne un masque à utiliser lors d'une étape de fabrication d'un dispositif d'affichage électroluminescent organique, et qui comporte une section de masque perforé plus mince que les sections de masque perforé classiques. Un substrat (6) est transporté dans un appareil de traitement sous vide (10), et le masque (1) et le substrat (6) sont alignés l'un avec l'autre. Le masque (1) comporte : un cadre (8) ; la section de masque perforé en forme de bande (2) métallique disposée sur le cadre (8) ; un appareil de fixation (3) qui attache une extrémité de la section de masque perforé (2) ; un élément de conversion (4) qui fait passer l'autre extrémité de la section de masque perforé (2) de la direction horizontale à la direction verticale ; et un poids (5) qui est fixé à l'autre extrémité. Une force de traction est appliquée à la section de masque perforé (2) par le poids (5). Comme la section de masque perforé (2) ne se détend pas sous la force de traction, le plasma réactif ne pénètre pas entre la section de masque perforé et le substrat (6). Grâce à la section de masque perforé (2), qui est plus mince que les sections de masque perforé classiques, un film plus uniforme peut également être formé sur la surface du substrat (6) à la périphérie du masque (1).