POLYMERIZABLE COMPOSITION FOR SOLDER RESIST, AND SOLDER RESIST PATTERN FORMATION METHOD
A polymerizable composition for a solder resist, comprising an infrared ray blocking material, a polymerization initiator and a polymerizable compound; and a solder resist pattern formation method using the polymerizable composition for a solder resist. La présente invention concerne une composition...
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| Main Authors | , , , |
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| Format | Patent |
| Language | English French Japanese |
| Published |
04.08.2011
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A polymerizable composition for a solder resist, comprising an infrared ray blocking material, a polymerization initiator and a polymerizable compound; and a solder resist pattern formation method using the polymerizable composition for a solder resist.
La présente invention concerne une composition polymérisable pour réserve de soudure comprenant un matériau de blocage des rayons infrarouges, un initiateur de polymérisation et un composé polymérisable. La présente invention concerne également un procédé de formation d'un motif de réserve de soudure utilisant la composition polymérisable pour réserve de soudure. |
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| AbstractList | A polymerizable composition for a solder resist, comprising an infrared ray blocking material, a polymerization initiator and a polymerizable compound; and a solder resist pattern formation method using the polymerizable composition for a solder resist.
La présente invention concerne une composition polymérisable pour réserve de soudure comprenant un matériau de blocage des rayons infrarouges, un initiateur de polymérisation et un composé polymérisable. La présente invention concerne également un procédé de formation d'un motif de réserve de soudure utilisant la composition polymérisable pour réserve de soudure. |
| Author | IKEDA, KIMI YABUKI, YOSHIHARU ARIOKA, DAISUKE SHIMADA, KAZUTO |
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| Discipline | Medicine Chemistry Sciences Physics |
| DocumentTitleAlternate | COMPOSITION POLYMÉRISABLE POUR RÉSERVE DE SOUDURE ET PROCÉDÉ DE FORMATION D'UN MOTIF DE RÉSERVE DE SOUDURE |
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| Notes | Application Number: WO2010JP72154 |
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| RelatedCompanies | FUJIFILM CORPORATION IKEDA, KIMI YABUKI, YOSHIHARU ARIOKA, DAISUKE SHIMADA, KAZUTO |
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| Snippet | A polymerizable composition for a solder resist, comprising an infrared ray blocking material, a polymerization initiator and a polymerizable compound; and a... |
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| SubjectTerms | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
| Title | POLYMERIZABLE COMPOSITION FOR SOLDER RESIST, AND SOLDER RESIST PATTERN FORMATION METHOD |
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