METHOD FOR CLEANING FILM FORMING APPARATUS, FILM FORMING METHOD, AND FILM FORMING APPARATUS
Plasma is generated between a cathode electrode (11) and an anode electrode (12) under a first condition. After that, plasma is generated under a second condition that is different from the first condition. Under the second condition, the plasma spreads further outwardly between the cathode electrod...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English French Japanese |
Published |
03.05.2012
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | Plasma is generated between a cathode electrode (11) and an anode electrode (12) under a first condition. After that, plasma is generated under a second condition that is different from the first condition. Under the second condition, the plasma spreads further outwardly between the cathode electrode (11) and the anode electrode (12) in comparison to the case under the first condition. As a result, materials adhering to the members provided in the vicinity of the outer peripheries of the electrodes can be quickly removed in addition to materials adhering to the electrodes.
Du plasma est généré entre une électrode de cathode (11) et une électrode d'anode (12) dans une première condition. Après cette étape, du plasma est généré dans une seconde condition qui est différente de la première condition. Dans la seconde condition, le plasma se répand davantage vers l'extérieur entre l'électrode de cathode (11) et l'électrode d'anode (12) par rapport à la première condition. En conséquence, les matières collant aux éléments situés à proximité des périphéries extérieures des électrodes peuvent être rapidement retirées avec les matières collant aux électrodes. |
---|---|
Bibliography: | Application Number: WO2010JP71995 |