METHOD OF FORMING A DEEP TRENCH IN A SUBSTRATE

• Main Authors: PAMARTHY, SHARMA, V, FARR, JON, C, RAORANE, DIGVIJAY, SIRAJUDDIN, KHALID, M
• Format: Patent
• Language: English; French
• Published: 31.03.2011
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Methods of forming deep trenches in substrates are described. A method includes providing a substrate with a patterned film disposed thereon, the patterned film including a trench having a first width and a pair of sidewalls, the trench exposing the top surface of the substrate. The method also incl...