SEMICONDUCTOR CHIP WITH STAIR ARRANGEMENT BUMP STRUCTURES

Various semiconductor chip input/output structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first conductor structure on a first side of a semiconductor chip and forming a second conductor structure in electrical conta...

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Bibliographic Details
Main Authors LOW, YIP SENG, TOPACIO, RODEN R
Format Patent
LanguageEnglish
French
Published 17.03.2011
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:Various semiconductor chip input/output structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first conductor structure on a first side of a semiconductor chip and forming a second conductor structure in electrical contact with the first conductor structure. The second conductor structure is adapted to be coupled to a solder structure and includes a stair arrangement that has at least two treads. L'invention concerne diverses structures d'entrée/de sortie de puce à semi-conducteur et leurs procédés de fabrication. Selon un aspect, l'invention concerne un procédé de fabrication consistant à former une première structure de conducteur sur un premier côté d'une puce à semi-conducteur et à former une seconde structure de conducteur en contact électrique avec la première structure de conducteur. La seconde structure de conducteur est conçue pour être couplée à une structure de soudure et comprend un agencement en escalier présentant au moins deux marches.
Bibliography:Application Number: WO2010CA01403