ETHYLENE RESIN COMPOSITION, SEALING MATERIAL FOR SOLAR CELL, AND SOLAR CELL MODULE UTILIZING THE SEALING MATERIAL

• Main Authors: IKENAGA, SHIGENOBU, YARIMIZU, KAZUHIRO, HAKUTA, TAKASHI, TAKEUCHI, FUMITO, MUROFUSHI, TAKANOBU, TOKUHIRO, JUN, MORI, HIROSHI, ZENKOH, HIROFUMI
• Format: Patent
• Language: English; French; Japanese
• Published: 09.12.2010
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

Disclosed are: an ethylene resin composition which has excellent properties including adhesion properties, electrically insulating properties, transparency, moldability and process stability and can be produced without requiring any cross-linking procedure if necessary to improve productivity; and others. The ethylene resin composition contains a modified product produced by modifying an ethylene polymer (A) that meets all of the requirements a) to e) mentioned below with an ethylenically unsaturated silane compound (B). a) The density is 900 to 940 kg/m3. b) The melting peak temperature is 90 to 125°C as determined by DSC. c) The melt flow rate (MFR2) is 0.1 to 100 g/10 minutes as measured at 190°C and a load of 2.16 kg in accordance with JIS K-6721. d) The Mw/Mn ratio is 1.2 to 3.5. e) The content of metal residues is 0.1 to 50 ppm. L'objectif de l'invention est d'obtenir notamment une composition de résine éthylène permettant d'accroître la productivité en fonction des besoins par omission de la réticulation, tout en présentant d'excellentes caractéristiques telles que des propriétés adhésives, d'isolation électrique, de transparence, d'aptitude au moulage et de stabilité du procédé. La composition de résine éthylène contient une forme modifiée obtenue par la modification, au moyen d'un composé de silane éthyléniquement non saturé (B), d'un polymère d'éthylène (A) remplissant dans le même temps l'ensemble des conditions a) à e) suivantes: a) une densité de 900 à 940 kg/m³; b) une température maximum de fusion par DSC de 90 à 125°C; c) un indice de fluage (MFR2) de 0,1 à 100 g/10 minutes comme déterminé à 190°C sous une charge de 2,16 kg conformément à JIS K-6721; d) un rapport Mw/Mn de 1,2 à 3,5 et e) 0,1 à 50 ppm de résidu métallique.