PHOTOSENSITIVE RESIN COMPOSITION, ADHESIVE FILM, AND LIGHT RECEIVING DEVICE

Disclosed are a photosensitive resin composition, an adhesive film comprising the photosensitive resin composition, and a light receiving device formed using the adhesive film, wherein the photosensitive resin composition produces little resin residues after patterning by exposure to light and devel...

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Main Authors YONEYAMA, MASAHIRO, SATO, TOSHIHIRO, DEJIMA, HIROHISA, SHIRAISHI, FUMIHIRO, TAKAHASHI, TOYOSEI, KAWATA, MASAKAZU
Format Patent
LanguageEnglish
French
Japanese
Published 21.10.2010
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:Disclosed are a photosensitive resin composition, an adhesive film comprising the photosensitive resin composition, and a light receiving device formed using the adhesive film, wherein the photosensitive resin composition produces little resin residues after patterning by exposure to light and developing and enables the reduction of dew drops formed between a semiconductor wafer and a transparent substrate under high-temperature/high-humidity environments. The photosensitive resin composition comprises (A) an alkali-soluble resin, (B) a photopolymerization initiator, and (C) a compound having a phenolic hydroxyl group and a carboxyl group. L'invention porte sur une composition de résine photosensible, sur un film adhésif comprenant la composition de résine photosensible, et sur un dispositif de réception de lumière formé à l'aide du film adhésif, la composition de résine photosensible fournissant peu de résidus de résine après formation de motif par exposition à la lumière et développement et permettant la réduction de gouttes de rosée formées entre une plaquette semi-conductrice et un substrat transparent dans des environnements haute température/humidité élevée. La composition de résine photosensible comprend (A) une résine soluble dans les alcalis, (B) un initiateur de photopolymérisation et (C) un composé ayant un groupe hydroxyle phénolique et un groupe carboxyle.
Bibliography:Application Number: WO2010JP02562