THERMOSETTING RESIN COMPOSITION, AND PREPREG, INSULATING FILM WITH SUPPORT, LAMINATE PLATE, AND PRINTED WIRING BOARD, EACH OBTAINED USING SAME

• Main Authors: MURAI, HIKARI, TAKANEZAWA, SHIN, IZUMI, HIROYUKI, MIYATAKE, MASATO, KOTAKE, TOMOHIKO, TSUCHIKAWA, SHINJI, IRINO, TETSUROU
• Format: Patent
• Language: English; French; Japanese
• Published: 30.09.2010
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

Disclosed is a thermosetting resin composition which comprises: (A) a resin composition having an unsaturated maleimide group and produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups in each molecule with (b) an amine compound having at least two primary amino groups in each molecule in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound such as isocyanate-masked imidazole or epoxy-masked imidazole. Further disclosed are a prepreg, an insulating film with a support, a laminate plate, and a printed wiring board, each obtained using the same. La composition de résine thermodurcissable ci-décrite comprend : (A) une composition de résine ayant un groupe maléimide insaturé et obtenue par réaction de (a) un composé maléimide ayant au moins deux groupes maléimide N-substitués par molécule avec (b) un composé amine ayant au moins deux groupes aminés primaires par molécule dans un solvant organique ; (B) une résine thermodurcissable ; et (C) un composé imidazole modifié tel qu'un imidazole masqué par un isocyanate ou un imidazole masqué par une époxy. Un pré-imprégné, un film d'isolation sur support, une plaque stratifiée, et une carte de circuit imprimé, tous obtenus au moyen de la composition de résine thermodurcissable selon l'invention sont, en outre, décrits.