SUPPORT FOR A SEMICONDUCTOR WAFER IN A HIGH TEMPERATURE ENVIRONMENT
A wafer support for supporting a semiconductor wafer during a process including varied temperature. The wafer support includes a body having a top surface adapted to receive the semiconductor wafer so a portion of the top surface supports the wafer. The top surface has a recessed area including an i...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English French |
Published |
22.04.2010
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | A wafer support for supporting a semiconductor wafer during a process including varied temperature. The wafer support includes a body having a top surface adapted to receive the semiconductor wafer so a portion of the top surface supports the wafer. The top surface has a recessed area including an inclined surface rising from a bottom of the recessed area. The inclined surface has an incline angle that is no more than about ten degrees.
L'invention concerne un support pour plaquette destiné à supporter une plaquette à semi-conducteur pendant un processus comportant une température modifiée. Le support de plaquette comporte un corps ayant une surface supérieure destinée à recevoir la plaquette à semi-conducteur, de façon qu'une partie de la surface supérieure supporte la plaquette. La surface supérieure présente une zone évidée comportant une surface inclinée s'élevant à partir d'un fond de la zone évidée. La surface inclinée présente un angle d'inclinaison qui n'excède pas environ dix degrés. |
---|---|
AbstractList | A wafer support for supporting a semiconductor wafer during a process including varied temperature. The wafer support includes a body having a top surface adapted to receive the semiconductor wafer so a portion of the top surface supports the wafer. The top surface has a recessed area including an inclined surface rising from a bottom of the recessed area. The inclined surface has an incline angle that is no more than about ten degrees.
L'invention concerne un support pour plaquette destiné à supporter une plaquette à semi-conducteur pendant un processus comportant une température modifiée. Le support de plaquette comporte un corps ayant une surface supérieure destinée à recevoir la plaquette à semi-conducteur, de façon qu'une partie de la surface supérieure supporte la plaquette. La surface supérieure présente une zone évidée comportant une surface inclinée s'élevant à partir d'un fond de la zone évidée. La surface inclinée présente un angle d'inclinaison qui n'excède pas environ dix degrés. |
Author | GILMORE, BRIAN, LAWRENCE SNYDER, TIMOTHY, JOHN SHIVE, LARRY, WAYNE |
Author_xml | – fullname: GILMORE, BRIAN, LAWRENCE – fullname: SHIVE, LARRY, WAYNE – fullname: SNYDER, TIMOTHY, JOHN |
BookMark | eNrjYmDJy89L5WRwDg4NCPAPClFw8w9ScFQIdvX1dPb3cwl1DgHywx3dXIMUPP2AEh6e7h4KIa6-Aa5BjiGhQa4Krn5hnkH-fr6ufiE8DKxpiTnFqbxQmptB2c01xNlDN7UgPz61uCAxOTUvtSQ-3N_IwNDAwMTUyNjc0ciYOFUABrcuPg |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | SUPPORT POUR PLAQUETTE A SEMI-CONDUCTEUR DANS UN ENVIRONNEMENT A HAUTE TEMPERATURE |
ExternalDocumentID | WO2010045237A2 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_WO2010045237A23 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 12:00:18 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English French |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_WO2010045237A23 |
Notes | Application Number: WO2009US60512 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100422&DB=EPODOC&CC=WO&NR=2010045237A2 |
ParticipantIDs | epo_espacenet_WO2010045237A2 |
PublicationCentury | 2000 |
PublicationDate | 20100422 |
PublicationDateYYYYMMDD | 2010-04-22 |
PublicationDate_xml | – month: 04 year: 2010 text: 20100422 day: 22 |
PublicationDecade | 2010 |
PublicationYear | 2010 |
RelatedCompanies | MEMC ELECTRONIC MATERIALS, INC GILMORE, BRIAN, LAWRENCE SNYDER, TIMOTHY, JOHN SHIVE, LARRY, WAYNE |
RelatedCompanies_xml | – name: SHIVE, LARRY, WAYNE – name: GILMORE, BRIAN, LAWRENCE – name: MEMC ELECTRONIC MATERIALS, INC – name: SNYDER, TIMOTHY, JOHN |
Score | 2.7730663 |
Snippet | A wafer support for supporting a semiconductor wafer during a process including varied temperature. The wafer support includes a body having a top surface... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS BLASTING DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS,IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KINDOF FURNACE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FURNACES HEATING KILNS LIGHTING MECHANICAL ENGINEERING OVENS RETORTS SEMICONDUCTOR DEVICES WEAPONS |
Title | SUPPORT FOR A SEMICONDUCTOR WAFER IN A HIGH TEMPERATURE ENVIRONMENT |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100422&DB=EPODOC&locale=&CC=WO&NR=2010045237A2 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1bS8MwFD6MKeqbTsXLlIDSt-K23p6GdG1qKzQptbu8DRdTEKQbruLf9yR2uqe9JTkhJIFz-ZKTLwD3oi8E-qE3s3RcadrCdlGlHGFaTumUigDFlepoIGVuPLafZ86sBR-btzCaJ_RbkyOiRgnU91rb69X_IVaocyvXD4t3bFo-RsUwNBp03NeUVkY4GtKMhzwwggBxm8HyRoaoy_PRYO9hIO2pBDA6Gal3KattpxIdw36G41X1CbRk1YHDYPP3WgcO0ubKG4uN9q1PFaFGlvG8IIjciE9e1BZyFo6DAutTP6I5SRgK4uQpJgVNM5rrrAZC2STJOVO8_WdwF9EiiE2czfxv8fMp3566dQ7talnJCyBeryx7Uv9g-4ooB2Faib0w-rdcSyLqu4TurpGudouv4ej3ntw2B4MutOvPL3mD7rde3Opd-wFg44DW |
link.rule.ids | 230,309,783,888,25578,76884 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFOebTsWPqQGlb8Vt_ZgvQ7o2tdU1KbX7eBuupiBIN1zFf99L7HRPe0tyISSBu8svufwO4DbrZBn6oTc9t2yhm5lpo0pZmW5YuZVLAhRbyKuBiNnByHyaWtMafKz_wiie0G9FjogalaG-l8peL_8vsTwVW7m6m79j0-LBT_ueVqHjjqK00rxBn8bc467muojbNJZUMkRdPQcN9g4esu8l0z4dD-S_lOWmU_EPYDfG8YryEGqiaELDXedea8JeVD15Y7HSvtWRJNSIY56kBJEbcciL3ELOvJGbYn3i-DQhIUNBED4GJKVRTBMV1UAoG4cJZ5K3_xhufJq6gY6zmf0tfjbhm1M3TqBeLApxCqTXzvO2UBlsXxHlIEzLsRee_g3bEIj6zqC1baTz7eJraARpNJwNQ_Z8Afu_b-am3u22oF5-folLdMXl_Ert4A-UG4PG |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=SUPPORT+FOR+A+SEMICONDUCTOR+WAFER+IN+A+HIGH+TEMPERATURE+ENVIRONMENT&rft.inventor=GILMORE%2C+BRIAN%2C+LAWRENCE&rft.inventor=SHIVE%2C+LARRY%2C+WAYNE&rft.inventor=SNYDER%2C+TIMOTHY%2C+JOHN&rft.date=2010-04-22&rft.externalDBID=A2&rft.externalDocID=WO2010045237A2 |