SUPPORT FOR A SEMICONDUCTOR WAFER IN A HIGH TEMPERATURE ENVIRONMENT

A wafer support for supporting a semiconductor wafer during a process including varied temperature. The wafer support includes a body having a top surface adapted to receive the semiconductor wafer so a portion of the top surface supports the wafer. The top surface has a recessed area including an i...

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Bibliographic Details
Main Authors GILMORE, BRIAN, LAWRENCE, SHIVE, LARRY, WAYNE, SNYDER, TIMOTHY, JOHN
Format Patent
LanguageEnglish
French
Published 22.04.2010
Subjects
BASIC ELECTRIC ELEMENTS
BLASTING
DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS,IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KINDOF FURNACE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FURNACES
HEATING
KILNS
LIGHTING
MECHANICAL ENGINEERING
OVENS
RETORTS
SEMICONDUCTOR DEVICES
WEAPONS
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Summary:A wafer support for supporting a semiconductor wafer during a process including varied temperature. The wafer support includes a body having a top surface adapted to receive the semiconductor wafer so a portion of the top surface supports the wafer. The top surface has a recessed area including an inclined surface rising from a bottom of the recessed area. The inclined surface has an incline angle that is no more than about ten degrees. L'invention concerne un support pour plaquette destiné à supporter une plaquette à semi-conducteur pendant un processus comportant une température modifiée. Le support de plaquette comporte un corps ayant une surface supérieure destinée à recevoir la plaquette à semi-conducteur, de façon qu'une partie de la surface supérieure supporte la plaquette. La surface supérieure présente une zone évidée comportant une surface inclinée s'élevant à partir d'un fond de la zone évidée. La surface inclinée présente un angle d'inclinaison qui n'excède pas environ dix degrés.
Bibliography:Application Number: WO2009US60512