LEAD FRAME SUBSTRATE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

A lead frame substrate includes: a metal plate having a first surface and a second surface; a connection post formed on the first surface; a wiring structure formed on the second surface; and a resin layer for pre-mold.  The resin layer for pre-mold has a thickness identical to the height of the con...

Full description

Saved in:
Bibliographic Details
Main Authors TODA, JUNKO, TSUKAMOTO, TAKEHITO, MANIWA, SUSUMU
Format Patent
LanguageEnglish
French
Japanese
Published 01.04.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A lead frame substrate includes: a metal plate having a first surface and a second surface; a connection post formed on the first surface; a wiring structure formed on the second surface; and a resin layer for pre-mold.  The resin layer for pre-mold has a thickness identical to the height of the connection post. L'invention porte sur un substrat de grille de connexion qui comprend : une plaque métallique ayant une première surface et une seconde surface ; une tige de connexion formée sur la première surface ; une structure de câblage formée sur la seconde surface ; et une couche de résine pour prémoulage. La couche de résine pour prémoulage a une épaisseur identique à la hauteur de la tige de connexion.
Bibliography:Application Number: WO2009JP04993