SYSTEM AND METHOD UTILIZING REDUNDANCY IN SEMICONDUCTOR CHIP INTERCONNECTS

An integrated circuit, or combination of integrated circuits, has a primary interconnect, a redundant interconnect, and circuitry connecting the primary and redundant interconnects allowing selection of the redundant interconnect to bypass the primary interconnect. L'invention concerne un circu...

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Bibliographic Details
Main Authors PETROV, TSVETOMIR, ARABI, KARIM, LAISNE, MICHAEL
Format Patent
LanguageEnglish
French
Published 18.03.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An integrated circuit, or combination of integrated circuits, has a primary interconnect, a redundant interconnect, and circuitry connecting the primary and redundant interconnects allowing selection of the redundant interconnect to bypass the primary interconnect. L'invention concerne un circuit intégré, ou une combinaison de circuits intégrés, comportant une interconnexion primaire, une interconnexion redondante, et un circuit connectant les interconnexions primaire et secondaire et permettant de choisir l'interconnexion redondante afin d'éviter l'interconnexion primaire.
Bibliography:Application Number: WO2009US55854