CIRCUIT MATERIALS, CIRCUITS LAMINATES, AND METHOD OF MANUFACTURE THEREOF

A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70...

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Bibliographic Details
Main Authors PAUL, SANKAR, CAISSE, CHRISTOPHER, J, BAARS, DIRK, M, HORN, ALLEN, F
Format Patent
LanguageEnglish
French
Published 21.01.2010
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent. L'invention concerne un stratifié de substrat de circuit, comprenant une couche métallique conductrice ; et un matériau composite diélectrique ayant une constante diélectrique inférieure à environ 3,5, et un facteur de dissipation inférieur à environ 0,006, le matériau composite diélectrique comprenant : une résine polymère ; et d'environ 10 à environ 70 pour cent en volume de cénosphères ayant une teneur en oxyde sphérique inférieure ou égale à 3 pour cent en poids.
Bibliography:Application Number: WO2009US50968