COPPER POWDER FOR CONDUCTIVE PASTE, AND CONDUCTIVE PASTE

• Main Authors: UWAZUMI YOSHIAKI, YOSHIMARU KATSUHIKO, OTA KOYU, MIYAKE KOICHI, KURIMOTO TORU
• Format: Patent
• Language: English; French; Japanese
• Published: 14.01.2010
• Subjects: ALLOYS; BASIC ELECTRIC ELEMENTS; CABLES; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; CASTING; CHEMISTRY; CONDUCTORS; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; INSULATORS; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; METALLURGY; PERFORMING OPERATIONS; POWDER METALLURGY; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WORKING METALLIC POWDER

A copper powder for a conductive paste contains 0.1 atm%-10 atm% of Si (silicon) and 0.1 atm%-10 atm% of In in the particle.  It is preferable that the copper powder for a conductive paste contains 0.1 atm%-10 atm% of Ag (silver) in the particle.  It is also preferable that the copper powder for a c...