A SEMICONDUCTOR STRUCTURE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR STRUCTURE

• Main Authors: ORATTI KALANDAR, NAVAS, KHAN, KRIPESH, VAIDYANATHAN, ZHANG, XIAOWU, KHONG, CHEE HOUE
• Format: Patent
• Language: English; French
• Published: 03.12.2009
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

According to one embodiment of the present invention, a semiconductor structure is provided. The semiconductor structure includes a first support structure, a plurality of chips formed on the first support structure and a reinforcing structure formed on the first support structure, the reinforcing structure including an outer surrounding element which surrounds the plurality of chips and extends from a surface of the first support structure to a height higher than each of the plurality of chips. A method of manufacturing a semiconductor structure is also provided. La présente invention concerne une structure semi-conductrice selon un mode de réalisation. Ladite structure comprend une première structure de support, une pluralité de puces formées sur la première structure de support et une structure de renfort formée sur la première structure de support, la structure de renfort comprenant un élément environnant externe qui entoure la pluralité de puces et s'étend à partir d'une surface de la première structure de support à une hauteur plus grande que chaque puce de la pluralité de puces. L'invention concerne également un procédé de fabrication d'une structure semi-conductrice.