EPOXY RESIN COMPOSITION FOR PRINTED WIRING BOARD, SOLDER RESIST COMPOSITION, RESIN FILM, RESIN SHEET, PREPREG, METAL FOIL WITH RESIN, COVER LAY, AND FLEXIBLE PRINTED WIRING BOARD

• Main Authors: ISHIKAWA, YOHSUKE, OZEKI, TAKAYOSHI, ESAKI, YOSHIAKI, OKUNO, SHINJI, ITOU, KATSUHIKO
• Format: Patent
• Language: English; French; Japanese
• Published: 03.12.2009
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

Disclosed is an epoxy resin composition for printed wiring boards, which can improve all of storage stability, adhesion, bendability and fillability. The epoxy resin composition for printed wiring boards contains, as essential components, (A) an epoxy resin, (B) an epoxy resin curing agent and (C) a carbodiimide-modified soluble polyamide. L'invention concerne une composition de résine époxy pour tableaux de connexions imprimés, qui peut améliorer la stabilité au stockage, l'adhésion, la capacité de pliage et la capacité de remplissage. La composition de résine époxy pour tableaux de connexions imprimés contient, en tant que composants essentiels, (A) une résine époxy, (B) un agent de durcissement de résine époxy et (C) un polyamide soluble modifié par un carbodiimide.