WATER-REACTIVE Al COMPOSITE MATERIAL, WATER-REACTIVE Al FILM, PROCESS FOR PRODUCTION OF THE Al FILM, AND CONSTITUENT MEMBER FOR FILM DEPOSITION CHAMBER

• Main Authors: KADOWAKI YUTAKA, LIM KENG WENG, MUSHIAKE KATSUHIKO, SAITOU TOMOKO
• Format: Patent
• Language: English; French; Japanese
• Published: 05.11.2009
• Subjects: ALLOYS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; FERROUS OR NON-FERROUS ALLOYS; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TREATMENT OF ALLOYS OR NON-FERROUS METALS

A water-reactive Al composite material which consists essentially of 4N Al (aluminum having a purity of 99.99 %) or 5N Al (aluminum having a purity of 99.999%), 2 to 5wt% of In, and 0.04 to 0.6wt% (in total) of Si inclusive of contaminant Si, with each percentage being based on Al; an Al sprayed film produced by using the material; production of the Al film; and a constituent member for a film deposition chamber, which member is provided with the Al sprayed film on the surface. L'invention concerne un matériau composite d'Al réagissant avec l'eau, essentiellement constitué d'Al 4N (aluminium d'une pureté de 99,99 %) ou d'Al 5N (aluminium d'une pureté de 99,999 %), de 2 à 5 % en poids d'In et de 0,04 à 0,6 % en poids (au total) de Si, y compris les contaminations de Si, chaque pourcentage étant calculé par rapport à l'Al, un film pulvérisé d'Al produit en utilisant le matériau, la production du film d'Al et un élément constitutif pour chambre de dépôt de film, lequel élément est doté du film d'Al pulvérisé sur sa surface.