ADHESIVE COMPOSITION, ADHESIVE FOR CIRCUIT CONNECTION, CONNECTED STRUCTURE, AND SEMICONDUCTOR DEVICE

• Main Authors: YANAGAWA, TOSHIYUKI, HORIUCHI, TAKESHI, FUJINAWA, TOHRU, MATSUSHITA, MASATOSHI
• Format: Patent
• Language: English; French; Japanese
• Published: 22.10.2009
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; INSULATORS; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-LINEAR OPTICS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PHYSICS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

Disclosed is an adhesive composition containing (a) a thermoplastic resin, (b) a radically polymerizable compound containing two or more (meth)acryloyl groups and two or more urethane bonds in a molecule and having a weight average molecular weight of not less than 10,000 and (c) a radical polymerization initiator. The adhesive composition exhibits sufficient adhesion even when the composition is cured at a low temperature in a short time, and has excellent storage stability. A connected structure using the adhesive composition has high connection reliability even after long-time exposure to high temperature and high humidity environments. An adhesive for circuit connection using the adhesive composition, a connected structure and a semiconductor device are also disclosed. L'invention porte sur une composition adhésive contenant (a) une résine thermoplastique, (b) un composé polymérisable par voie radicalaire contenant au moins deux groupes (méth)acryloyles et au moins deux liaisons uréthane dans une molécule et ayant une masse moléculaire moyenne en poids de pas moins de 10 000 et (c) un initiateur de polymérisation radicalaire. La composition adhésive présente une adhérence suffisante même lorsque la composition est durcie à basse température sur une courte durée et a une excellente stabilité au stockage. Une structure connectée utilisant la composition adhésive a une fiabilité de connexion élevée même après une exposition de longue durée à des environnements de température élevée et d'humidité élevée. L'invention porte également sur un adhésif pour une connexion de circuit utilisant la composition adhésive, sur une structure connectée et sur un dispositif à semi-conducteur.