BACKPLANE STRUCTURES FOR SOLUTION PROCESSED ELECTRONIC DEVICES

There is provided a backplane for an organic electronic device. The backplane has a TFT substrate; a thick organic planarization layer (50); a multiplicity of electrode structures; and a thin insulative inorganic bank structure (70) defining a multiplicity of pixel openings (80) on the electrode str...

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Bibliographic Details
Main Author TSAI, YAW-MING, A
Format Patent
LanguageEnglish
French
Published 29.04.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:There is provided a backplane for an organic electronic device. The backplane has a TFT substrate; a thick organic planarization layer (50); a multiplicity of electrode structures; and a thin insulative inorganic bank structure (70) defining a multiplicity of pixel openings (80) on the electrode structures. La présente invention concerne un panneau arrière pour un dispositif électronique organique. Le panneau arrière présente un substrat TFT; une couche de planarisation organique épaisse; une multiplicité de structures d'électrodes; et une mince structure de bloc inorganique isolante définissant une multiplicité d'ouvertures de pixels sur les structures d'électrodes.
Bibliography:Application Number: WO2008US77711