BONDING MATERIAL FOR HONEYCOMB STRUCTURE AND HONEYCOMB STRUCTURE UTILIZING THE MATERIAL

• Main Authors: KODAMA, SUGURU, WATANABE, ATSUSHI, ICHIKAWA, SHUICHI, SATO, FUMIHARU
• Format: Patent
• Language: English; French; Japanese
• Published: 29.01.2009
• Subjects: ARTIFICIAL STONE; CEMENTS; CERAMICS; CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY; CHEMISTRY; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS; CONCRETE; LIME, MAGNESIA; METALLURGY; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; REFRACTORIES; SEPARATION; SLAG; THEIR RELEVANT APPARATUS; TRANSPORTING; TREATMENT OF NATURAL STONE

A bonding material for honeycomb structure, comprising inorganic particles of 10 to 500 D90/D10, 100 µm or less D10 and 4 µm or more D90 (wherein D10 and D90 are the values of 10% diameter and 90% diameter from the smaller particle diameter side, respectively, in volume-based cumulative fractions of...