BONDING MATERIAL FOR HONEYCOMB STRUCTURE AND HONEYCOMB STRUCTURE UTILIZING THE MATERIAL

A bonding material for honeycomb structure, comprising inorganic particles of 10 to 500 D90/D10, 100 µm or less D10 and 4 µm or more D90 (wherein D10 and D90 are the values of 10% diameter and 90% diameter from the smaller particle diameter side, respectively, in volume-based cumulative fractions of...

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Bibliographic Details
Main Authors KODAMA, SUGURU, WATANABE, ATSUSHI, ICHIKAWA, SHUICHI, SATO, FUMIHARU
Format Patent
LanguageEnglish
French
Japanese
Published 29.01.2009
Subjects
ARTIFICIAL STONE
CEMENTS
CERAMICS
CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY
CHEMISTRY
COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS
CONCRETE
LIME, MAGNESIA
METALLURGY
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
REFRACTORIES
SEPARATION
SLAG
THEIR RELEVANT APPARATUS
TRANSPORTING
TREATMENT OF NATURAL STONE
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Summary:A bonding material for honeycomb structure, comprising inorganic particles of 10 to 500 D90/D10, 100 µm or less D10 and 4 µm or more D90 (wherein D10 and D90 are the values of 10% diameter and 90% diameter from the smaller particle diameter side, respectively, in volume-based cumulative fractions of a particle diameter distribution measured by a laser diffraction/scattering method). L'invention porte sur un matériau de liaison pour une structure en nid d'abeilles, comprenant des particules inorganiques de D90/D10 de 10 à 500, de D10 de 100 µm ou moins et de D90 de 4 µm ou plus (où D10 et D90 sont les valeurs respectivement de10% du diamètre et de 90% du diamètre à partir du côté du plus petit diamètre de particule dans des fractions cumulées basées sur le volume d'une distribution du diamètre de particule mesuré par une méthode de diffraction/diffusion laser).
Bibliography:Application Number: WO2008JP63359