LEAD-FREE SOLDER FOR VEHICLE, AND IN-VEHICLE ELECTRONIC CIRCUIT

• Main Authors: MATSUSHITA, KAZUHIRO, SAKAMOTO, MASASHI, KAWAMATA, YUJI, TAMURA, TOMU, UESHIMA, MINORU
• Format: Patent
• Language: English; French; Japanese
• Published: 22.01.2009
• Subjects: ALLOYS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WELDING; WORKING BY LASER BEAM

Disclosed is an Sn-Ag-Cu-Bi lead-free solder having excellent heat cycle resistance and mechanical strength, which can be used for soldering of an in-vehicle electronic circuit. The solder comprises the following components: Ag: 2.8-4 mass%, Bi: 1.5-6 mass% and Cu: 0.8-1.2 mass%, with the remainder...