LEAD-FREE SOLDER FOR VEHICLE, AND IN-VEHICLE ELECTRONIC CIRCUIT

Disclosed is an Sn-Ag-Cu-Bi lead-free solder having excellent heat cycle resistance and mechanical strength, which can be used for soldering of an in-vehicle electronic circuit. The solder comprises the following components: Ag: 2.8-4 mass%, Bi: 1.5-6 mass% and Cu: 0.8-1.2 mass%, with the remainder...

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Bibliographic Details
Main Authors MATSUSHITA, KAZUHIRO, SAKAMOTO, MASASHI, KAWAMATA, YUJI, TAMURA, TOMU, UESHIMA, MINORU
Format Patent
LanguageEnglish
French
Japanese
Published 22.01.2009
Subjects
ALLOYS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FERROUS OR NON-FERROUS ALLOYS
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
PRINTED CIRCUITS
SOLDERING OR UNSOLDERING
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WELDING
WORKING BY LASER BEAM
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Summary:Disclosed is an Sn-Ag-Cu-Bi lead-free solder having excellent heat cycle resistance and mechanical strength, which can be used for soldering of an in-vehicle electronic circuit. The solder comprises the following components: Ag: 2.8-4 mass%, Bi: 1.5-6 mass% and Cu: 0.8-1.2 mass%, with the remainder being Sn. L'invention concerne une brasure sans plomb Sn-Ag-Cu-Bi ayant une excellente résistance au cycle de traitement thermique et une excellente résistance mécanique. Ladite brasure sans plomb peut être utilisée pour le brasage d'un circuit électronique embarqué. La brasure comporte les composants suivants : Ag : 2,8-4 % en masse, Bi : 1,5-6 % en masse et Cu : 0,8-1,2 % en masse, le reste étant du Sn.
Bibliography:Application Number: WO2008JP62716