LEAD-FREE SOLDER FOR VEHICLE, AND IN-VEHICLE ELECTRONIC CIRCUIT

• Main Authors: MATSUSHITA, KAZUHIRO, SAKAMOTO, MASASHI, KAWAMATA, YUJI, TAMURA, TOMU, UESHIMA, MINORU
• Format: Patent
• Language: English; French; Japanese
• Published: 22.01.2009
• Subjects: ALLOYS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WELDING; WORKING BY LASER BEAM

Disclosed is an Sn-Ag-Cu-Bi lead-free solder having excellent heat cycle resistance and mechanical strength, which can be used for soldering of an in-vehicle electronic circuit. The solder comprises the following components: Ag: 2.8-4 mass%, Bi: 1.5-6 mass% and Cu: 0.8-1.2 mass%, with the remainder being Sn. L'invention concerne une brasure sans plomb Sn-Ag-Cu-Bi ayant une excellente résistance au cycle de traitement thermique et une excellente résistance mécanique. Ladite brasure sans plomb peut être utilisée pour le brasage d'un circuit électronique embarqué. La brasure comporte les composants suivants : Ag : 2,8-4 % en masse, Bi : 1,5-6 % en masse et Cu : 0,8-1,2 % en masse, le reste étant du Sn.