LOW-PROFILE HEAT-SPREADING LIQUID CHAMBER USING BOILING

• Main Authors: KIM, JESSE JAEJIN, YOU, SEUNG MUN, KIM, JOO HAN, KWARK, SANG M
• Format: Patent
• Language: English; French
• Published: 02.10.2008
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

Systems and fabrication methods are disclosed for a heat spreader to cool a device. The heat spreader has first and second opposing proximal surfaces defining a chamber having a liquid therein; and one or more structures mounted in the chamber to induce a liquid flow pattern during a boiling of the...