LOW-PROFILE HEAT-SPREADING LIQUID CHAMBER USING BOILING

Systems and fabrication methods are disclosed for a heat spreader to cool a device. The heat spreader has first and second opposing proximal surfaces defining a chamber having a liquid therein; and one or more structures mounted in the chamber to induce a liquid flow pattern during a boiling of the...

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Bibliographic Details
Main Authors KIM, JESSE JAEJIN, YOU, SEUNG MUN, KIM, JOO HAN, KWARK, SANG M
Format Patent
LanguageEnglish
French
Published 02.10.2008
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:Systems and fabrication methods are disclosed for a heat spreader to cool a device. The heat spreader has first and second opposing proximal surfaces defining a chamber having a liquid therein; and one or more structures mounted in the chamber to induce a liquid flow pattern during a boiling of the liquid to distribute heat. L'invention concerne des systèmes et des procédés de fabrication d'une unité de dissipation de la chaleur pour refroidir un dispositif. L'unité de dissipation de la chaleur présente des première et seconde surfaces proximales opposées définissant une chambre renfermant un liquide ; et une ou plusieurs structures montées dans la chambre pour induire un motif d'écoulement de liquide pendant l'ébullition du liquide pour distribuer la chaleur.
Bibliography:Application Number: WO2008US57135