EMBEDDED INDUCTOR AND METHOD OF PRODUCING THEREOF

A method of manufacturing an inductor embedded into a semiconductor chip package (100) is described, which method comprises providing a carrier (102; 202; 302) having, between a first side and an opposite second side, a first conductive layer (104; 503), an intermediate layer (205; 505), a second co...

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Bibliographic Details
Main Authors DIRKS, PETER, HERES, KLAAS
Format Patent
LanguageEnglish
French
Published 06.11.2008
Subjects
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