EMBEDDED INDUCTOR AND METHOD OF PRODUCING THEREOF
A method of manufacturing an inductor embedded into a semiconductor chip package (100) is described, which method comprises providing a carrier (102; 202; 302) having, between a first side and an opposite second side, a first conductive layer (104; 503), an intermediate layer (205; 505), a second co...
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Main Authors | , |
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Format | Patent |
Language | English French |
Published |
06.11.2008
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Subjects | |
Online Access | Get full text |
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