STRUCTURE FOR COOLING SEMICONDUCTOR ELEMENT

A structure for cooling a semiconductor element is provided with a semiconductor element (1); a heat sink (2) whereupon the semiconductor element (1) is mounted; and a heat storage member (3), which is attached to the semiconductor element (1) on a side opposite to the side whereupon the heat sink (...

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Bibliographic Details
Main Authors OSADA, HIROSHI, YOSHIDA, TADAFUMI, YOKOI, YUTAKA
Format Patent
LanguageEnglish
French
Japanese
Published 14.08.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A structure for cooling a semiconductor element is provided with a semiconductor element (1); a heat sink (2) whereupon the semiconductor element (1) is mounted; and a heat storage member (3), which is attached to the semiconductor element (1) on a side opposite to the side whereupon the heat sink (2) is mounted, and includes a case (31) and a latent heat storage material (32). L'invention concerne une structure pour le refroidissement d'un élément semi-conducteur pourvue d'un élément semi-conducteur (1); un dissipateur de chaleur (2) sur lequel l'élément semi-conducteur (1) est monté ; et un élément de stockage de chaleur (3), qui est fixé à l'élément semi-conducteur (1) sur un côté opposé au côté sur lequel le dissipateur de chaleur (2) est monté, et qui contient un boîtier (31) et un matériau de stockage thermique latent (32).
Bibliography:Application Number: WO2008JP52094