METHOD OF SEMICONDUCTOR PACKAGING AND/OR A SEMICONDUCTOR PACKAGE

The method (100) includes forming a leadframe (leadframe forming 102). The leadframe is directly bonded to the semiconductor chip (leadframe bonding 104). The leadframe is flexed and/or compressed in a mould cavity (leadframe compression 106). The compressed leadframe and the chip are moulded into a...

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Bibliographic Details
Main Author TONG, SOON HOCK
Format Patent
LanguageEnglish
French
Published 24.07.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The method (100) includes forming a leadframe (leadframe forming 102). The leadframe is directly bonded to the semiconductor chip (leadframe bonding 104). The leadframe is flexed and/or compressed in a mould cavity (leadframe compression 106). The compressed leadframe and the chip are moulded into a package (moulding 108). Le procédé (100) comprend la fabrication d'une grille de connexion (fabrication d'une grille de connexion 102). La grille de connexion est directement liée à la puce semi-conductrice (liaison de grille de connexion 104). La grille de connexion est fléchie et/ou comprimée dans une cavité de moule (compression de grille de connexion 106). La grille de connexion comprimée et la puce sont moulées en un boîtier (moulage 108).
Bibliography:Application Number: WO2007SG00013