COOLING STRUCTURE FOR SEMICONDUCTOR DEVICE

• Main Authors: OSADA, HIROSHI, YOSHIDA, TADAFUMI, YOKOI, YUTAKA
• Format: Patent
• Language: English; French; Japanese
• Published: 17.07.2008
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A cooling structure for a semiconductor device, the structure having first and second semiconductor devices (11, 12), a heat sink (2), and projections (3). The heat sink (2) has a mounting surface (2A) where the semiconductor devices (11, 12) are mounted and also has formed inside it a refrigerant f...