THERMAL EJECTION OF SOLUTION HAVING SOLUTE ONTO DEVICE MEDIUM

• Main Authors: LEIGH, DAVID, SAMUEL, NK PETER, NIELSEN, JEFFREY A, GISEL, WAYNE E, MEEHAN, GERALD F, OTIS, DAVID, FAAR, ISAAC
• Format: Patent
• Language: English; French
• Published: 06.11.2008
• Subjects: APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; PERFORMING OPERATIONS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

A solution is provided that includes a non-aqueous organic solvent within which a solute has been dissolved (102). A thermal-fluid ejection mechanism is provided that has fluid-ejection nozzles and that is capable of thermally ejecting the solutio (104). A device medium is provided that has a three-dimensional surface on which the solution is to be ejected (106). The fluid-ejection nozzles of the thermal fluid-ejection mechanism are controlled to eject the solution onto the three-dimensional surface of the device medium in accordance with a desired pattern (108). L'invention concerne une solution comprenant un solvant organique non aqueux dans lequel un soluté a été dissous (102). L'invention concerne également un mécanisme d'éjection de fluide thermique ayant des buses d'éjection de fluide et étant capable d'éjecter thermiquement la solution (104). L'invention concerne également le support d'un dispositif ayant une surface tridimensionnelle sur laquelle la solution doit être éjectée (106). Les buses d'éjection du fluide du mécanisme d'éjection d'un fluide thermique sont contrôlées pour éjecter la solution sur la surface tridimensionnelle du support du dispositif selon un motif souhaité (108).