EPOXY RESIN COMPOSITION FOR PRINTED WIRING BOARD, RESIN COMPOSITION VARNISH, PREPREG, METAL CLAD LAMINATE, PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD

• Main Authors: IMAIZUMI, EIJI, FUJINO, KENTAROU, ARAKI, SHUNJI, SHINPO, TAKASHI, TAMIYA, HIROKI, NAKAMURA, YOSHIHIKO, SAWADA, TOMOAKI
• Format: Patent
• Language: English; French; Japanese
• Published: 20.03.2008
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

An epoxy resin composition for printed wiring board characterized by containing (A) epoxy resin component containing epoxy resin (A-1) having a nitrogen atom and a bromine atom in each single molecule, (B) phenolic hardener component containing phenolic resin (B-1) and (C) hardening accelerator component containing imidazolesilane compound (C-1). L'invention concerne une composition de résine époxy pour tableau de connexions imprimé caractérisée par le fait qu'elle contient (A) un composant de résine époxy contenant de la résine époxy (A-1) ayant un atome d'azote et un atome de brome dans chaque molécule simple, (B) un composant durcisseur phénolique contenant une résine phénolique (B-1) et (C) un composant accélérateur du durcissement contenant un composé imidazolesilane (C-1).