SCALABLE LIQUID COOLING SYSTEM WITH MODULAR RADIATORS
A scalable and modular cooling system is disclosed. The cooling system includes an air plenum with a plurality of expansion slots. Each expansion slot is configured to receive a modularly configured fluid-to-air heat exchanger, such as a radiator. The air plenum also include one or more air movers f...
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Main Authors | , , |
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Format | Patent |
Language | English French |
Published |
15.11.2007
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Subjects | |
Online Access | Get full text |
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Summary: | A scalable and modular cooling system is disclosed. The cooling system includes an air plenum with a plurality of expansion slots. Each expansion slot is configured to receive a modularly configured fluid-to-air heat exchanger, such as a radiator. The air plenum also include one or more air movers for blowing air through the expansion slots, and therefore through any radiators fitted within the expansion slots. For those expansion slots that are not used, a blanking plate is fitted to each unused expansion slot. Each blanking plate is modularly configured in a manner similar to the modularly configured radiators. In this manner, air bypass is substantially prevented. Each radiator is part of an independent cooling loop, used directly or indirectly to cool heat generating devices.
Système de refroidissement adaptable et modulaire, qui comprend un plénum à plusieurs fentes d'expansion, chacune capable de recevoir un échangeur thermique modulaire fluide-air, du type radiateur. Le plénum comprend aussi une ou plusieurs soufflantes soufflant l'air à travers ces fentes, et donc à travers les radiateurs installés dans les fentes. Pour les fentes non utilisées, une plaque d'obturation est équipée dans chaque fente de cette catégorie. Chaque plaque d'obturation est modulaire, à l'instar des radiateurs modulaires. Ainsi, on empêche sensiblement la dérivation d'air. Chaque radiateur fait partie d'une boucle de refroidissement indépendante, chauffant directement ou indirectement les dispositifs générateurs de chaleur. |
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Bibliography: | Application Number: WO2007US10853 |